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 Application

 

 Release Liner Material

 

Nan Ya PEPA® Application Electronic material release
( Heat seal connector )

Specifications:

     PEPA®:PL-100、PS-110
 
 

Description:

     The release material used in electronics must meet dust–free, low static electricity, and scratch-resistant requirements. PEPA® is in line with these demands and offers the market an additional option in this area.
※We recommend this product for supply factories of the release material for electronics.
 
 

Advantage:

1. Dust-free, has low static electricity, and is scratch-resistant on the surface.
2. High quality, good whiteness and opacity.
3. Water resistant and tear resistant.
 
 

Procedure:

   Sheet PL,PS grade processing of punching finished product

Possibility of Material Application

 
 
 

Product Characteristic:

Characteristic comparison PEPA® CAPA®
1  Recommended
 choice:
PL-100、PS-110 BCA、BCP、BCD、BCT、BCH
2  Thickness 35μ~800μ 100、110 0.08~0.4mm
3  Smoothness
4  Thickness uniformity
5  Coating effects
6  Stiffness
7  Proportion 0.74~0.80 1.03~1.375
8  Punching and stamping
9  Applicable temperature -15~120℃ 100~140℃
10  Moisture resistance
11  Color matching and
 color modulation
X
12  Project development
13  Price comparison Medium-low Medium
  Contact us Contact us
X→No、→OK、○→Well、→Excellent
 
 
(NPC, Mar 1, 2023)
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