Specifications：
CAPA® Synthetic paper：BCA |
Description：
The main difference between packaging products for electronic chips and those of ordinary products is that the anti-static electricity feature should be additionally strengthened to prevent damage to the chip caused by static electricity. On the contrary, the resistance of NAN YA electronic level packaging synthetic paper is between 10-8~10-10Ω, thus providing better anti-static abilities, and it is a solid core material, so it will leave no crumbs or layer stripping. |
Advantage： |
| 1. |
This paper is made without DIOXCIENE and in accordance with the demands of environmentally friendly materials (requirements of EN-71, RoHS, REACH, etc.), with better printing properties and without the precipitation pollution problem of DOP. |
| 2. |
It has a wider range of uses, processing temperatures, and sizes; furthermore, its characteristics include steadiness, temperature endurance, cold endurance, and weather resistance. |
| 3. |
It was developed with the R&D design characteristic of maneuvering and elasticity; different design elements, such as color, thickness, embossing, hardness, etc., can be custom manufactured. |
| 4. |
It can be cut and punched at any angle and with any space between, and the finished product cannot be easily deformed or ripped, thus allowing it to achieve the best design effects. |
| 5. |
It has a higher anti-static electric level with a solid core material and can be shaped with suction. Furthermore, it will produce no crumbs or layer stripping, so it is fit for use in the dust-free inner packaging. |
Product Application：
1.Chip packaging。
2.Wafer carrier and Lead frame。 |
Procedure：
STEAK → slitting or packaging → punching → finished product
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